CMP Pads
Presenting new standards for semiconductor wafer planarization with Global No.1 CMP Pad Technology
WHY IT MATTERS
CMP pads that unlock next-gen integration
We localized CMP pads once dominated by overseas suppliers, combining polyurethane expertise with rapid customization to support every wafer layer from STI to advanced Cu/oxide steps.
- Full in-house value chain. Prepolymer design, casting, surface tuning and inspection all under one roof.
- Customer-first co-design. Groove, bottom stack and polymer tuning respond quickly to new device nodes.
- ESG-ready chemistry. VDC-free, MOCA-free and bio-based formulations reduce risk while meeting corporate goals.
Plants
2 sites
Two domestic production hubs
Process coverage
STI · ILD · W · Cu
Pad families for each CMP layer
Lead time
Fast
Co-developed recipes move to pilots within weeks
Quality
MES + RTDB
Smart factory traceability & SPC dashboards
Core Technology & Competitiveness
In-house materials
From prepolymer to final pad, every ingredient is designed internally for stability.
Process pairing
CMP performance and defect control are tuned together to match each customer specification.
Surface engineering
Hybrid pore plus surface modification unlock consistent removal rates and low scratches.
PRODUCT FAMILIES
Choose the pad concept that fits your CMP stage
Three product pillars highlight the concept-level value; for detailed specs simply reach our sales team through the contact page.
Series overview
Baseline stability for metal & dielectric layers
V-HD is the go-to platform for core metal/dielectric steps, balancing pad life and removal consistency while adapting to customer groove and slurry requirements.
- High-volume references across W/Cu/Poly
- Process-specific groove & template design
- Uniformity controls for multi-layer stacks
- Joint pilot support before ramp
* Detailed models and recipes are shared once our sales team receives your inquiry.
Series overview
High removal with defect suppression
V-IS/V-HT/V-RD tailor porosity, density and network rigidity to push oxide/ILD throughput while holding scratch and defectivity below fab targets.
- Oxide/ILD focused recipes
- Hard-mask ready stiffness options
- Porosity + surface co-engineering
- Defect mitigation playbooks
* Specific parameters are provided after our sales team reviews your process data.
Series overview
ESG-ready chemistries & reclaim pilots
V/M/E/B explores chlorine-free, MOCA-free and bio-based materials while preparing reclaim/buffing scenarios for fabs with ESG mandates.
- VDC/MOCA-free options
- Chlorine-down formulary
- Bio-derived material pilots
- Reclaim/buffing reuse planning
* ESG certificates and pilot data are shared upon request through the sales inquiry form.
| Model | Key specs | Primary layer |
|---|---|---|
| V | VDC-free formulations compliant with chlorine limits | Metal CMP |
| M & E | MOCA-free and dual-free chemistries ready for HVM | Mixed dielectric/metal |
| B | Bio-based blends plus reclaim/buffing reuse pilots | Eco/specialty lines |
NEXT STEP
Talk with our CMP Specialists
Share the process layer you’re tackling and use the contact page to reach the right owner for layer-specific spec sheets, samples and a joint recipe plan.